Method for manufacturing bendable and/or resilient substrate, involves adjusting material properties of conductive layer in deformation minimized layer region so as to bend substrate

摘要

The method involves providing bendable and/or resilient upper sub-layers (14) and lower sub-layer (12) on substrate (18). A conductive layer (10) is arranged between the sub-layers such that curable liquid droplets are applied on surface of conductive layer. A functional layer is formed between upper sub-layer and lower sub-layer. The material properties of conductive layer in deformation minimized layer region (16) are adjusted so as to bend the substrate.