Interconnection structure a cavity having one or several ski lift of contact on the walls of the cavity and advantages of

摘要

The present invention relates to an interconnection device comprising a support (200) in which at least one hole is made, the hole with the walls forming a closed contour and being formed of a cavity (203) and one or more grooves (205a - 205b, 215a - 215b) communicating with the cavity, the grooves extending in a direction making an angle not - zero with the main plane of the support, a plurality of conductive elements (214) being arranged on at least one wall of the hole and passing through this latter, the conducting elements, each being intended to connect together the conductive zones located on either side of the support, at least one of said grooves separating two conducting elements.