Forming wiring pattern by laser irradiation, comprises e.g. coating light-sensitive material on substrate to form light-sensitive layer and irradiating laser beam on substrate to form pattern including exposed region and unexposed region

摘要

Forming a wiring pattern by laser irradiation (S1), comprises: coating a light-sensitive material on a substrate (S11) to form light-sensitive layer; irradiating a laser beam on light-sensitive material of the substrate to form a pattern which includes an exposed region and unexposed region (S13); and forming metallic wiring pattern by placing substrate into a solution having many metallic nanoparticles (S15), where the metallic nanoparticles are attached to the exposed region, and a molecular structure of the light-sensitive material in the exposed region is changed by laser irradiation.