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Drilling and cutting metallic material by laser beam by subjecting metal material to impact of laser beam to operate onset of melting localized from material, and continuing localized melting of material started in subjecting step
Drilling and cutting metallic material by laser beam by subjecting metal material to impact of laser beam to operate onset of melting localized from material, and continuing localized melting of material started in subjecting step
The method comprises subjecting a metal material to an impact of a laser beam so as to operate an onset of melting localized from the material under the effect of the laser beam, continuing the localized melting of the material started in the subjecting step without moving the laser beam relative to the material, and measuring a light intensity reflected by the metallic material subjected to the impact of the laser beam and converting the light intensity into a voltage value of 1-9 V representing the measured light intensity. The method comprises subjecting a metal material to an impact of a laser beam to operate an onset of melting localized from the material under the effect of the laser beam, continuing the localized melting of the material started in the subjecting step without moving the laser beam relative to the material, measuring a light intensity reflected by the metallic material subjected to the impact of the laser beam and converting the light intensity into a voltage value of 1-9 V representing the measured light intensity, comparing the voltage value representing the measured light intensity to a value of reference voltage corresponding to a reference voltage data, and detecting the end time of the drilling material or defect drilling. The light intensity is measured by a photodiode. The step of detection of the drilling defect, when the voltage value corresponds to the measured light intensity, exceeds a first value of voltage reference data corresponding to a first intensity value of maximum predetermined reference. The method further comprises immediately stopping the drilling when measured voltage value is greater than the reference voltage data, triggering a duration of given time difference (T), while maintaining the localized melting of the material, when the voltage value corresponding to measured light intensity is lower or equal to a second value of reference voltage data corresponding to a second intensity value of maximum predetermined reference, detecting the moment of the end of the drilling of material when the voltage value corresponding to the measured light intensity is lower or equal to a third value of reference voltage data corresponding to a third intensity value of maximum predetermined reference, relatively moving the laser beam relative to the material when voltage value is less than reference voltage data after the duration of time difference (T), and continuing the movement of the laser beam relative to the material according to a cutting path data while operating a complete melting over the entire thickness from the material along the cutting path. The laser beam is generated by a laser source of fiber type, disk, neodymium:yttrium aluminum garnet or carbon dioxide. An independent claim is included for a laser cutting installation.
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