PIEZOELECTRIC FILM STRUCTURE, ELECTROMECHANICAL CONVERSION ELEMENT, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a piezoelectric film structure which improves the heat-resistant adhesiveness between a diaphragm and a lower electrode and achieves the stability; and to provide an electromechanical conversion element, a droplet discharge head, and a droplet discharge apparatus.;SOLUTION: A piezoelectric film structure includes: a silicone oxide film 2 located on a silicon substrate 1; a film structure formed on the silicone oxide film 2 and having a thermal expansion coefficient larger than that of the silicon substrate 1; an alumina film 5 formed on the film structure; a lower electrode 6 provided on the alumina film 5; a piezoelectric film 7 provided on the lower electrode 6; and an upper electrode 8 provided on the piezoelectric film 7.;COPYRIGHT: (C)2013,JPO&INPIT