首页> 外国专利> RESIN MOLDED MEMBER COMPRISING CONDUCTIVE RESIN MATERIAL, CONDUCTIVE RESIN COMPONENT COMPRISING THE RESIN MOLDED MEMBER AND COUPLING MEMBER, AND METHOD FOR COUPLING OF THE RESIN MOLDED MEMBER AND THE COUPLING MEMBER

RESIN MOLDED MEMBER COMPRISING CONDUCTIVE RESIN MATERIAL, CONDUCTIVE RESIN COMPONENT COMPRISING THE RESIN MOLDED MEMBER AND COUPLING MEMBER, AND METHOD FOR COUPLING OF THE RESIN MOLDED MEMBER AND THE COUPLING MEMBER

机译:包含导电树脂材料的树脂模制构件,包含树脂模制构件和连接构件的导电树脂组分,以及用于将树脂模制构件与连接构件耦合的方法

摘要

PROBLEM TO BE SOLVED: To provide a resin molded member for efficiently performing an electrostatic coating securing conduction using a conductive resin molded article, and also to provide a method for forming a conductive resin component having high conductivity by bonding of the resin molded member and the coupling member.;SOLUTION: A resin molded member 11 comprising a conductive resin molded article is formed so that a portion thereof is fractured when bonding the conductive coupling member 21 thereto, and thereby a highly conductive inner layer is exposed. By bonding the coupling member 21 to the resin molded member 11 to form the conductive resin component, both members 11 and 21 are integrated, thus enabling an efficient electrostatic coating.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种用于使用导电性树脂成型体有效地进行确保导电性的静电涂装的树脂成型体,并且提供一种通过将树脂成型体与导电性树脂结合而形成导电性高的导电性树脂成分的方法。解决方案:形成包括导电树脂模制件的树脂模制件11,以便在将导电耦合件21粘结到其上时其一部分破裂,从而露出高导电性的内层。通过将耦合部件21粘合到树脂成型部件11上以形成导电树脂组件,将部件11和21集成在一起,从而实现有效的静电涂层。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2013215904A

    专利类型

  • 公开/公告日2013-10-24

    原文格式PDF

  • 申请/专利权人 HONDA MOTOR CO LTD;

    申请/专利号JP20120085914

  • 申请日2012-04-04

  • 分类号B29C65/56;

  • 国家 JP

  • 入库时间 2022-08-21 17:02:18

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号