LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition that has an electromagnetic wave-absorbing performance in a wide range of frequency domain, allows a cured product with high thermal shock resistance to be obtained, and is excellent in handleability; and to provide a semiconductor apparatus sealed with the composition.;SOLUTION: A liquid epoxy resin composition for sealing a semiconductor has electromagnetic shielding properties and comprises (A) an epoxy resin, (B) a curing agent, (C) a silicone-modified epoxy resin, and (D) a scale-like soft magnetic metal powder. The liquid epoxy resin composition allows an electromagnetic wave-absorbing cured product to be obtained, wherein the cured product has a thickness of 0.5 mm or larger and shows reflection attenuation properties (S11) in a range of 2 to 10 GHz.;COPYRIGHT: (C)2013,JPO&INPIT