首页> 外国专利> SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION, AND METHOD FOR MANUFACTURING SUSPENSION WITH ELEMENT

SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, HARD DISK DRIVE, METHOD FOR MANUFACTURING SUBSTRATE FOR SUSPENSION, AND METHOD FOR MANUFACTURING SUSPENSION WITH ELEMENT

机译:悬浮物,悬浮物,带元素的悬浮物,硬盘驱动器,制造悬浮物的方法以及使用元素制造悬浮物的方法

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a suspension suited to joining using a solder jet method and not impairing followability of an element.;SOLUTION: The substrate for the suspension comprises: a metal support substrate; an insulating layer formed on the metal support substrate; and a wiring layer formed on the insulating layer. The insulating layer comprises an insulating layer end portion which overhangs from an end face of a terminal section of the wiring layer and supports the element. A penetrating section in which the insulating layer end portion and a tongue portion of the metal support substrate are not superposed in a plan view is formed between the insulating layer end portion and the tongue portion of the metal support substrate. The present invention solves the problem by providing the substrate for the suspension.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种悬架的基板,该悬架的基板适合于使用焊料喷射法进行连接并且不损害元件的可跟随性。在金属支撑基板上形成的绝缘层;布线层形成在绝缘层上。绝缘层包括绝缘层端部,该绝缘层端部从布线层的端子部的端面伸出并支撑元件。在金属支撑基板的绝缘层端部与舌部之间形成有俯视观察时金属绝缘基板的绝缘层端部与舌部不重叠的贯穿部。本发明通过提供用于悬架的基板解决了该问题。版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013149341A

    专利类型

  • 公开/公告日2013-08-01

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20130065933

  • 发明设计人 ONUKI MASAO;

    申请日2013-03-27

  • 分类号G11B5/60;G11B21/21;

  • 国家 JP

  • 入库时间 2022-08-21 17:00:57

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