PROBLEM TO BE SOLVED: To provide a curing agent excellent in low temperature curability, solvent resistance and storage stability.SOLUTION: This curing agent includes a compound represented by general formula (1) and/or a compound represented by the formula (1) substituted with an alkoxy group having a specific imidazole structure at the ortho site (in formula, R-Reach independently represents a hydrogen atom, a 1-18C alkyl group which may be substituted or a 1-18C aryl group which may be substituted, at least one of R-Rrepresents a 1-8C alkyl group which may be substituted or a 1-8C aryl group which may be substituted and n is an integer of 0-10).
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