Curing agent for epoxy resin, curing agent for microcapsule type epoxy resin, curing agent composition for masterbatch type epoxy resin, one-pack type epoxy resin composition and processed product

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent which not only has sufficient curability but also has a decreased coagulation ratio of particles of the epoxy resin curing agent with each other, and is excellent both in storage stability and crevice permeability.SOLUTION: The epoxy resin curing agent is a solid at 25°C and contains particles. The particles have a particle size Dat a cumulative undersize fraction of 50% is more than 0.3 μm and 12 μm or less, and has a particle size distribution defined by (D/D), a ratio of a particle size Dat a cumulative undersize fraction of 99% to the particle size D, the particle size at a cumulative undersize fraction of 50%, is 6 or less. A specific surface area value (Y) and the particle size D(X) of the particles satisfies a relationship represented by the following formula (1), and a moisture content of the epoxy resin curing agent is 1.5% or less: 4.0X≤Y≤8.3X(1).