Microcapsule type curing agent for epoxy resin, a master - batch type curing agent for epoxy resin composition, one-component epoxy resin composition, and processed products

摘要

And a (S) shell that covers the core and are formed as a starting material (H) epoxy resin curing agent (C), and the core (C), the average particle size of the epoxy resin curing agent (H) The content ratio of small particle size epoxy resin curing agent as defined in 0.5 times the average particle size of the epoxy resin curing agent, and is 12μm or less (H) beyond 0.3μm 0 is 15% .1%, the shell (S), linking group linking group which absorbs infrared wavenumber 1630~1680cm ^-1 and (x), to absorb the infrared wave number 1680~1725cm ^-1 and (y) and , It is characterized by having at least on the surface and (z) linking group which absorbs infrared wavenumber 1730~1755cm ^-1, excellent storage stability, yet microencapsulated epoxy resin hardener having excellent reactive steepness I can realize the agent and the like.