Method for power distribution, three-dimensional VLSI, (distribution and heat sink integrated transmission for the integrated circuit) data processing system and an integrated transmission over the heat sink

摘要

Problem to be solved: to provide a mechanism for integrated transmission and distribution through a heat sink. This mechanism is coupled to a processor layer coupled to a signaling and I / O (I / O) layer via a first coupling device set and a second layer coupled to the processor layer via a second coupling device set Include sink. In this mechanism, the heat sink includes a plurality of grooves on one surface, each groove provides either a path for power delivered to the processor layer or a path for ground. In this mechanism, the heat sink is dedicated to power transmission, and does not provide data communication signals to the elements of the mechanism; signaling and I / O (I / O) layers transmit and transmit data communication signals to the processor layer and processor It is dedicated only to the reception of data communication signals from the Ya and does not provide power to the elements of the processor layer. Diagram