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POSTCURING TAPE AND JOINING METHOD FOR JOINING MEMBER

机译:加入会员的后贴带和加入方法

摘要

PROBLEM TO BE SOLVED: To provide a postcuring tape excellent in adhesion and water-resistant adhesion that cures at a comparatively low temperature and in a short time and is free from contamination near the joint, and to provide a joining method for joining members using the postcuring tape.;SOLUTION: The postcuring tape includes an adhesive layer containing a (meth) acryl-based polymer, an epoxy resin and an amine-based epoxy latent heat curing agent, wherein the epoxy resin contains an epoxy resin of an epoxy equivalent of 800 or more and the content of the epoxy resin of an epoxy equivalent of 800 or more is 0.2-30 wt.% in the total amount of adhesive agents constituting the adhesive layer.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种粘合性和耐水性优异的后固化带,其在相对较低的温度下在短时间内固化并且在接合处附近无污染,并提供一种使用该接合剂接合构件的接合方法。解决方案:后固化带包括粘合层,该粘合层包含(甲基)丙烯酸类聚合物,环氧树脂和胺类环氧潜热固化剂,其中该环氧树脂包含环氧当量为800以上,且环氧当量800以上的环氧树脂的含量为构成粘合剂层的粘合剂总量的0.2-30 wt%.;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013006901A

    专利类型

  • 公开/公告日2013-01-10

    原文格式PDF

  • 申请/专利权人 SEKISUI CHEM CO LTD;

    申请/专利号JP20110138532

  • 发明设计人 TODA TOMOMOTO;

    申请日2011-06-22

  • 分类号C09J7/02;C09J5/06;C09J133/00;C09J163/00;

  • 国家 JP

  • 入库时间 2022-08-21 16:58:10

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