首页> 外国专利> MANUFACTURING METHOD OF BORED LAMINATE, BORED LAMINATE, MANUFACTURING METHOD OF MULTILAYER SUBSTRATE, COMPOSITION FOR FORMING GROUND LAYER

MANUFACTURING METHOD OF BORED LAMINATE, BORED LAMINATE, MANUFACTURING METHOD OF MULTILAYER SUBSTRATE, COMPOSITION FOR FORMING GROUND LAYER

机译:钻孔叠层的制造方法,钻孔叠层的制造,多层基板的制造方法,用于形成地层的组合物

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a bored laminate in which the form accuracy of holes formed by laser processing is excellent, and adhesion of a metal layer to be laminated is also excellent, and to provide a bored laminate obtained by the manufacturing method.SOLUTION: The manufacturing method of a bored laminate includes a boring step for forming a hole that reaches the surface of a first metal layer from the surface of a laminate to be processed on the plating layer side, by performing laser processing on the laminate to be processed including the first metal layer, a ground layer containing a polymer having a repeating unit having a cyano group and metal oxide particles, and a plating layer in this order on a substrate. The content of the repeating unit having a cyano group in the polymer is 10-60 mol% for all repeating units in the polymer, the grain size of the metal oxide particles is 50-2000 nm, and the content of the metal oxide particles in the ground layer is 20-60 mass%.
机译:解决的问题:提供一种钻孔层压体的制造方法,其中通过激光加工形成的孔的形状精度优异,并且待层压的金属层的粘附性也优异,并且提供一种通过该方法获得的钻孔层压体。解决方案:钻孔叠层板的制造方法包括钻孔步骤,该钻孔步骤是通过在基板上进行激光处理而形成的孔,该孔从待处理的叠层板的表面在电镀层一侧到达第一金属层的表面。包括第一金属层,包含具有具有氰基和金属氧化物颗粒的重复单元的聚合物的底层,以及在基板上依次形成的镀层的待处理层压体。对于聚合物中的所有重复单元,在聚合物中具有氰基的重复单元的含量为10-60mol%,金属氧化物颗粒的粒径为50-2000nm,并且,底层为20-60质量%。

著录项

  • 公开/公告号JP2013080733A

    专利类型

  • 公开/公告日2013-05-02

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20110218472

  • 发明设计人 TSUKAMOTO NAOKI;

    申请日2011-09-30

  • 分类号H05K3/46;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:53

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