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METHOD FOR CONTROLLING COPPER SULFATE-PLATING BATH, AND METHOD FOR PRODUCING COPPER-PLATED FILM
METHOD FOR CONTROLLING COPPER SULFATE-PLATING BATH, AND METHOD FOR PRODUCING COPPER-PLATED FILM
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机译:硫酸铜镀浴的控制方法和铜镀膜的生产方法
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摘要
PROBLEM TO BE SOLVED: To estimate a hardener concentration in an original copper sulfate-plating bath in which a copper plated film is formed while producing a photogravure without producing a copper-plated film for physical property evaluation which is not counted among production, and particularly to provide a method for controlling the copper sulfate-plating bath to control the concentration of a hardener to be added to the plating bath in order to stably produce the copper-plated film suitable for mechanical carving and ballade peeling, particularly in the production process of the photogravure.;SOLUTION: The method for estimating a hardener concentration in the copper sulfate-plating bath includes peeling a copper ballade from a cylinder after mechanical carving, and performing the scratch test of a copper-plated film surface.;COPYRIGHT: (C)2013,JPO&INPIT
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