The thermosetting conversion die resin constituent and its hardened material which include the chemical compound which possesses the fire resistance

摘要

PPROBLEM TO BE SOLVED: To provide a resin composition which is thermally cured, is tough, has high resistance to high temperature and high humidity, and further can obtain a molded material with a low dielectric constant. PSOLUTION: The thermosetting resin composition includes a phosphine oxide compound (A) represented by formula (I), and an epoxy compound (B). In formula, RSP1/SPrepresents 1-4C saturated or unsaturated hydrocarbon group, and RSP2/SPrepresents a hydrogen atom or 1-2C alkyl group. The resin composition is suitably used for an electrical insulating material, especially for a use such as a printed circuit board. PCOPYRIGHT: (C)2011,JPO&INPIT