BACK SCATTERING CORRECTION DEVICE, BACK SCATTERING CORRECTION METHOD, AND BACK SCATTERING CORRECTION PROGRAM

摘要

PROBLEM TO BE SOLVED: To reduce deviation between a resist pattern formed in a resist after lithography and a designed pattern, due to back scattering from a substrate.;SOLUTION: A back scattering correction device divides a drawing pattern design into plural unit sections, acquires a drawing density of each unit section to obtain a drawing correction value based on the drawing density, acquires pattern distribution divided by the density within the unit section to obtain a drawing correction value based on the pattern distribution, and adds the drawing correction value based on the drawing density and drawing correction value based on the pattern distribution to obtain an optimum exposure correction value.;COPYRIGHT: (C)2013,JPO&INPIT