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Etching device, my chroma scene production mannered

机译:蚀刻设备,我的色度场景制作风趣

摘要

PROBLEM TO BE SOLVED: To provide a technique for performing high-speed etching by a radical.;SOLUTION: The inside of a vacuum tank 11 is sectioned by a filter 30a into a radical generating chamber 3 and an etching chamber 4, and double domes are protruded into the radical generating chamber 3; and an etching gas containing a reducing gas and an oxidizing gas is introduced into the gap 27 of the double domes and a microwave is radiated from an antenna 24 to generate plasma, thereby radiating a generated radical into the radical generating chamber 3 from a discharge hole 28. The radical passes through small holes 32a of the filter 30a to move to the etching chamber 4, and removes the sacrificial layer of an object 22 to be etched by etching. Plasma of the reducing gas is generated on the surface of the object 22 to be etched, and oxide on the sacrificial layer formed by the radical of the oxidizing gas is reduced and removed to perform high-speed etching.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种通过自由基进行高速蚀刻的技术。解决方案:真空罐11的内部被过滤器30a分成自由基产生室3和蚀刻室4以及双圆顶。伸入自由基产生室3中;然后,将包含还原性气体和氧化性气体的蚀刻气体导入到双圆顶的间隙27中,从天线24辐射微波而产生等离子体,从而将生成的自由基从排出口放射到自由基产生室3中。 28.自由基通过过滤器30a的小孔32a移动至蚀刻室4,以通过蚀刻去除待蚀刻的物体22的牺牲层。还原气体的等离子体在要蚀刻的物体22的表面上产生,并且由氧化性气体的自由基形成的牺牲层上的氧化物被还原并去除以进行高速蚀刻。;版权所有:(C)2010 ,JPO&INPIT

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