首页> 外国专利> Substituted benzimidazole ring-containing bridged alicyclic compounds N-, N- substituted benzimidazole ring-containing polymer thin film and manufacturing method thereof

Substituted benzimidazole ring-containing bridged alicyclic compounds N-, N- substituted benzimidazole ring-containing polymer thin film and manufacturing method thereof

机译:取代的含苯并咪唑环的桥联脂环化合物n-,n-取代的含苯并咪唑环的聚合物薄膜及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide an N-substituted benzimidazole ring-containing bridged alicyclic compound capable of forming a thin film such as an insulation film having high heat resistance, a low relative permittivity, and low hygroscopicity.;SOLUTION: The N-substituted benzimidazole ring-containing bridged alicyclic compound is represented by formula (1) (wherein Z is a bridged alicyclic skeleton; Y1 is a single bond or a divalent organic group; Y2 is a single bond or a di- or tri-valent organic group; X is a reactive functional group; Ra is hydrogen or a hydrocarbon group; and A is an N-substituted benzimidazole group).;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种能够形成具有高耐热性,低相对介电常数和低吸湿性的诸如绝缘膜之类的薄膜的含N-取代的苯并咪唑环的桥连脂环族化合物;解决方案:N-取代的含苯并咪唑环的桥接脂环族化合物由式(1)表示(其中Z为桥接的脂环骨架; Y 1 为单键或二价有机基团; Y 2 是单键或二价或三价有机基团; X是反应性官能团; R a 是氢或烃基;并且A是N-取代的苯并咪唑基。 ;版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP5095300B2

    专利类型

  • 公开/公告日2012-12-12

    原文格式PDF

  • 申请/专利权人 株式会社ダイセル;

    申请/专利号JP20070208645

  • 发明设计人 舩木 克典;板谷 亮;宝来 晃;

    申请日2007-08-09

  • 分类号C07D235/20;H01L21/312;C08G73/18;C09D5/25;

  • 国家 JP

  • 入库时间 2022-08-21 16:56:46

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