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Heat sealable resin composition for liquid crystal polymer, heat seal material for liquid crystal polymer, cover material

机译:用于液晶聚合物的可热封树脂组合物,用于液晶聚合物的热封材料,覆盖材料

摘要

PPROBLEM TO BE SOLVED: To provide a heat-sealing resin composition for a liquid crystal polymer capable of providing a heat-sealing material which can be heat-sealed to an adherent consisting essentially of a liquid crystal polymer and has easily peeled properties of being easily peeled by hands after being heat sealed, to provide the heat-sealing material and to provide a lid material. PSOLUTION: The heat-sealing resin composition for the liquid crystal polymer used for the heat-sealing material heat-sealed on an adherent consisting essentially of the liquid crystal polymer includes: at least one resin (A) selected from a polyethylene resin (except the following (B)), a polypropylene resin and an ethylene vinylacetate copolymer; an ethylene -olefin copolymer (B) which is amorphous or has 20% crystallinity; and an adhesiveness imparting agent (C). PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:提供一种用于液晶聚合物的热封树脂组合物,该组合物能够提供热封材料,该热封材料可以被热封至基本上由液晶聚合物组成的粘合剂并且具有容易剥离的性能。热封后容易用手剥离的目的在于提供热封材料和盖材料。

解决方案:用于液晶聚合物的热封树脂组合物,其用于热密封在基本上由液晶聚合物组成的粘附体上的热封材料,包括:至少一种选自聚乙烯树脂的树脂(A)。 (以下(B)除外),聚丙烯树脂和乙烯乙酸乙烯酯共聚物;非晶态或结晶度为20%的乙烯-烯烃共聚物(B);和粘合性赋予剂(C)。

版权:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP5301479B2

    专利类型

  • 公开/公告日2013-09-25

    原文格式PDF

  • 申请/专利号JP20100027599

  • 发明设计人 牧 伸行;坂本 悠;

    申请日2010-02-10

  • 分类号C09J123;C09J123/08;C09J123/16;C09J7;B65D53;B65D65/40;

  • 国家 JP

  • 入库时间 2022-08-21 16:56:49

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