Semiconductor chip mounter and mounting system

摘要

PPROBLEM TO BE SOLVED: To prevent the generation of any faulty substrate, even for deviation at the time of wafer carrying in a semiconductor-chip mounting machine and chip mounting course. PSOLUTION: By a sucking nozzle 14 moving a predetermined chip T in a planar direction based on mapping data having evaluating data on the chip formed on a wafer W according to evaluating data, the semiconductor-chip mounting machine 10 sucks and mounts the chip on a substrate S has a means for calculating, by data associated with such a relative position of the chip on the wafer, the machine coordinate of the chip which is obtained when the wafer is placed on a predetermined position of the mounting machine, and a means (S6) for so collating the calculated machine coordinate with the machine coordinate corresponding thereto of the sucking position obtained by the sucking nozzle (S5) as to decide whether both the machine coordinates fall into a predetermined allowable scope or not. PCOPYRIGHT: (C)2008,JPO&INPIT