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摘要

Problem to be solved: to provide a crosslinking elastomer composition suitable as a molding material for a semiconductor manufacturing apparatus which is excellent in mechanical characteristics and has very small amounts of outgas such as DOP and is very clean. The composition is a cross-linked elastomer composition comprising a crosslinking elastomer component and silicon oxide fine particles, wherein the silicon oxide fine particles have hydroxyl groups of 100 x 1019 / g or less and the amount of dioctylphthalate adsorbed below 8 A composition of silicon oxide fine particles having an average particle size of 0.5. Mu. M or less.