The thermosetting metaplasia resin and the aromatic amines which consist of the resin composition for electronic part seal

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for sealing electronic components which can achieve hermetic seal between a package body containing an electronic component element and a lid material with sufficient reliability, and which can be cured with lower outgas, at lower temperature, and in a shorter time than conventional ones while control, maintenance and retention of a semi-cured state are possible, and a lid for sealing electronic components using the same.;SOLUTION: The resin composition for sealing electronic components includes a thermosetting resin, a semi-curing agent, a latent curing agent, and a stabilizer, wherein the thermosetting resin is an epoxy resin, the semi-curing agent is aromatic amines or alicyclic amines, the latent curing agent is an amine-based adduct-type latent curing agent, or an imidazole-based adduct-type latent curing agent, and the stabilizer is a boric ester compound, and further, an elastomer is preferably contained. The lid for sealing electronic components is obtained by forming the resin composition for sealing electronic components in a semi-cured state on a substrate.;COPYRIGHT: (C)2011,JPO&INPIT