Electrical process for filling a metal into the through-holes, especially electrical process for filling copper into through-holes of the printed circuit board

摘要

The present invention relates to an electrical treatment to fill a metal into the through holes. This process is particularly suitable for filling a copper in the through holes of the printed circuit board. Following steps, that is, forming a narrow section at the center of the through hole by (i) electroplating, the method fills the metal by electroplating the through holes is obtained (ii) in step (i) I comprises the step. None [Selection Figure]