Being pushed in by the through hole which is provided in the implemental structure where the attachment component and the attachment component are implemented on the circuit substrate,

摘要

It is an object to provide a holding member and the like that prevent leg sections from coming out of a through hole in a state in which the holding member is merely pushed into the through hole and yet to be soldered, without damaging a surface of an electric circuit board. A pair of leg sections 20 pushed into a through hole 51 have, at respective tips, respective claws 24a and 24b having slopes 25a and 25b, respectively. The slopes 25a and 25b extend in directions approaching each other and face in opposite directions while being inclined relative to a width direction of a base section 10. When the pair of leg sections 20 are pushed into the through hole 51 while contacting an inner surface of the through hole 51 at both ends in a longitudinal direction, the slopes 25a and 25b of the pair of leg sections 20 contact and press each other so that the claws 24a and 24b formed at the tips of the pair of leg sections 20 advance along the slopes 25a and 25b in a slanting direction, pass through the through hole 51, and protrude in a board thickness direction of the base section 10 beyond the through hole 51, thereby being caught on an edge of the through hole 51.