Contact sheets, probe, semiconductor wafer test apparatus, method of manufacturing a contact sheet, and test method of semiconductor wafer

摘要

And the core material 25, is made of a resin material, it is made of a metal material, and contact the ball 24 having a coating layer 26 covering the surface of the core material 25, the contact sheet 20, through-hole contact ball 24 is inserted has a, a sheet 22 of a pair 221 and 231 are respectively formed, while the contact ball 24 is inserted into the through holes 221 and 231, the ball contact 24 between the sheets 22 and 23 of the pair is held.