Bi-Sn-based method of manufacturing the reel winding solder wire and solder wire

摘要

PROBLEM TO BE SOLVED: To provide a solder thin wire which can be wound around a reel without any crack or breakage during drawing even when the solder wire is as hard as a Bi-Sn-based solder alloy having large Bi content and is scarcely elongated.;SOLUTION: The solder wire can be bent without causing any crack or breakage during the drawing by extruding the solder wire by an extrusion method while forming working lines in parallel and along the solder wire on the surface of the solder wire. The Bi-Sn-based solder has a composition of Bi-1 to 10 mass% Sn, and the diameter of the solder wire is 0.2-1.0 mm. The extrusion temperature of the solder wire is set to be 60-100°C, and an extrusion rate is set to be 10-50 m/hour.;COPYRIGHT: (C)2010,JPO&INPIT