Metal copper film and manufacturing method thereof, metal copper pattern and conductor wiring using the same, metal copper bump, heat conduction path, bonding material, and liquid composition

摘要

Provided are a metallic copper film having good substrate adhesion, low volume resistivity, and deep metallicity, and a method for producing a metallic copper film that can be produced by reducing the metallic copper film to a deep part without damaging the substrate. A copper-based particle deposition layer containing both a copper oxide and a metal-like transition metal or alloy, or a transition metal complex containing a metal element is heated with gaseous formic acid and / or formaldehyde heated to 120 ° C. or higher. It is a metal copper film characterized by processing. The copper oxide is preferably cuprous oxide and / or cupric oxide, and the transition metal, alloy, or metal complex is Cu, Pd, Pt, Ni, Ag, Au, and A metal selected from the group consisting of Rh, an alloy containing the metal, or a complex containing the metal element is preferable.