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ANALYZING A PATTERNING PROCESS USING A MODEL OF YIELD

机译:使用Yield模型分析拼版过程

摘要

Techniques are presented that include accessing results of forward simulations of circuit yield, the results including at least circuit yield results including simulated device shapes. Using the circuit yield results, high-level traits of at least the simulated device shapes are determined. Based on the determined high-level traits and using the circuit yield results, a compact model for predicted yield is constructed, the compact model including a plurality of adjustable parameters, and the constructing the compact model for predicted yield including adjusting the adjustable parameters until at least one first predetermined criterion is met. An optimization problem is constructed including at least the compact model for yield, an objective, and a plurality of constraints. Using the optimization problem, the objective is modified subject to the plurality of constraints until at least one second predetermined criterion is met.
机译:提出的技术包括访问电路良率的正向仿真结果,该结果至少包括电路良率结果,其中包括模拟器件形状。使用电路成品率结果,可以确定至少模拟器件形状的高级特征。基于确定的高级特征并使用电路成品率结果,构造用于预测产量的紧凑模型,该紧凑模型包括多个可调参数,并且构造用于预测产量的紧凑模型包括调节可调节参数,直到达到满足至少一个第一预定标准。构造优化问题,该优化问题至少包括用于产量,目标和多个约束的紧凑模型。使用最优化问题,根据多个约束条件修改目标,直到满足至少一个第二预定标准。

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