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Memory Structures and Arrays, and Methods of Forming Memory Structures and Arrays

机译:内存结构和数组,以及形成内存结构和数组的方法

摘要

Some embodiments include memory structures having a diode over a memory cell. The memory cell can include programmable material between a pair of electrodes, with the programmable material containing a multivalent metal oxide directly against a high-k dielectric. The diode can include a first diode electrode directly over one of the memory cell electrodes and electrically coupled with the memory cell electrode, and can include a second diode electrode laterally outward of the first diode electrode and not directly over the memory cell. Some embodiments include memory arrays comprising the memory structures, and some embodiments include methods of making the memory structures.
机译:一些实施例包括在存储单元上方具有二极管的存储结构。该存储单元可以包括在一对电极之间的可编程材料,该可编程材料包含直接抵靠高k电介质的多价金属氧化物。二极管可以包括直接在一个存储单元电极上方并且与存储单元电极电耦合的第一二极管电极,并且可以包括在第一二极管电极的横向外侧并且不直接在存储单元上方的第二二极管电极。一些实施例包括具有存储器结构的存储器阵列,并且一些实施例包括制造存储器结构的方法。

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