PREVENTION OF POST-PECVD VACUUM AND ABATEMENT SYSTEM FOULING USING A FLUORINE CONTAINING CLEANING GAS CHAMBER

摘要

Methods and apparatus for reducing post PECVD vacuum and abatement system fouling. Chamber cleaning times are reduced leading to increased efficiency and lower cost fabrication processes by introducing F₂ or a fluorine containing gas into the PECVD system. When using F₂, the cleaning gas may be introduced directly to desired locations of the system where it can interact without activation with unwanted deposits. Alternatively, the cleaning gas may be activated in-situ in the equipment using existing plasma discharge equipment, or the cleaning gas may be activated using an RPS and then introduced to the desired location in its already activated state.