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Droplet dispensing control method, droplet dispensing control device, and method of manufacturing semiconductor devices

机译:液滴分配控制方法,液滴分配控制装置以及半导体装置的制造方法

摘要

According to one embodiment, a droplet dispensing control method includes detecting an amount of positional deviation between a stage on which a substrate is mounted and a template as a template positional deviation amount and detecting an amount of positional deviation between a movement direction of the stage and a nozzle array direction as a nozzle positional deviation amount. The method further includes calculating a stage movement direction correction value and an ejection timing correction value of the imprint material as correction values for eliminating the positional deviation of the landing position of the imprint material. The method further includes controlling the movement direction of the stage using the stage movement direction correction value and controlling the ejection timing of the imprint material using the ejection timing correction value.
机译:根据一个实施例,一种液滴分配控制方法包括:检测其上安装有基板的台架与模板之间的位置偏差量作为模板位置偏差量;以及检测台架的移动方向与模板之间的位置偏差量。喷嘴列方向作为喷嘴位置偏差量。该方法还包括计算压印材料的台架移动方向校正值和喷射定时校正值作为用于消除压印材料的着陆位置的位置偏差的校正值。该方法还包括使用平台移动方向校正值来控制平台的移动方向,以及使用喷射定时校正值来控制压印材料的喷射定时。

著录项

  • 公开/公告号US8485624B2

    专利类型

  • 公开/公告日2013-07-16

    原文格式PDF

  • 申请/专利权人 IKUO YONEDA;SHINJI MIKAMI;

    申请/专利号US201113235054

  • 发明设计人 IKUO YONEDA;SHINJI MIKAMI;

    申请日2011-09-16

  • 分类号B41J29/38;

  • 国家 US

  • 入库时间 2022-08-21 16:47:09

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