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Semiconductor device including a DC-DC converter with schottky barrier diode

机译:半导体器件,包括带有肖特基势垒二极管的DC-DC转换器

摘要

In a non-insulated DC-DC converter having a circuit in which a power MOS•FET high-side switch and a power MOS•FET low-side switch are connected in series, the power MOS•FET low-side switch and a Schottky barrier diode to be connected in parallel with the power MOS•FET low-side switch are formed within one semiconductor chip. The formation region SDR of the Schottky barrier diode is disposed in the center in the shorter direction of the semiconductor chip, and on both sides thereof, the formation regions of the power MOS•FET low-side switch are disposed. From the gate finger in the vicinity of both long sides on the main surface of the semiconductor chip toward the formation region SDR of the Schottky barrier diode, a plurality of gate fingers are disposed so as to interpose the formation region SDR between them.
机译:在具有将功率MOS·FET高侧开关和功率MOS·FET低侧开关串联连接的电路的非绝缘DC-DC转换器中,功率MOS·FET低侧开关和肖特基与一个功率MOS•FET低侧开关并联的势垒二极管形成在一个半导体芯片内。肖特基势垒二极管的形成区域SDR被布置在半导体芯片的较短方向上的中央,并且在其两侧上布置了功率MOS·FET低侧开关的形成区域。从半导体芯片的主表面上的两个长边附近的栅指朝向肖特基势垒二极管的形成区域SDR,布置多个栅指以使其之间形成区域SDR。

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