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Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
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机译:水性酸性配方,用于去除氧化铜蚀刻残留物并防止铜电沉积
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摘要
A highly aqueous acidic cleaning composition for copper oxide etch removal from Cu-dual damascene microelectronic structures and wherein that composition prevents or substantially eliminates copper redeposition on the Cu-dual damascene microelectronic structure.
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