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Light fixture assembly having improved heat dissipation capabilities

机译:具有改善的散热能力的灯具组件

摘要

A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the illumination assembly, wherein the cover structure, which has an enlarged surface area formed of a heat conductive material, defines a decorative exterior of the light fixture and is disposed exterior of a mounting surface, thereby effectively dissipating the heat generated by the LED illumination assembly towards the environment being illuminated by the light fixture.
机译:包括一个或多个发光二极管形式的照明组件的灯具组件通过控制电路互连到电源。安装组件支撑照明组件,并且盖结构以与照明组件热传递的关系布置,其中具有由导热材料形成的扩大的表面积的盖结构限定了灯具的装饰性外部并且是设置在安装表面的外部,从而有效地将LED照明组件产生的热量散发到灯具所照明的环境。

著录项

  • 公开/公告号US8360614B1

    专利类型

  • 公开/公告日2013-01-29

    原文格式PDF

  • 申请/专利权人 DARYL SODERMAN;DALE B. STEPPS;

    申请/专利号US20100902852

  • 发明设计人 DARYL SODERMAN;DALE B. STEPPS;

    申请日2010-10-12

  • 分类号F21V29;

  • 国家 US

  • 入库时间 2022-08-21 16:43:42

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