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Interleaved three-dimensional on-chip differential inductors and transformers

机译：交错式三维片上差分电感器和变压器

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摘要

Interleaved three-dimensional (3D) on-chip differential inductors 110, 120 and transformer 100 are disclosed. The interleaved 3D on-chip differential inductors 110, 120 and transformer 100 make the best use of multiple metal layers in mainstream standard processes, such as CMOS, BiCMOS and SiGe technologies.

机译：公开了交错的三维（3D）片上差分电感器 110、120 和变压器 100 。交错的3D片上差分电感器 110、120 和变压器 100 在主流标准工艺（例如CMOS，BiCMOS和SiGe技术）中充分利用了多种金属层。 展开▼

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公开/公告号US8325001B2

专利类型

公开/公告日2012-12-04

原文格式PDF

申请/专利权人 DAQUAN HUANG;MAU-CHUNG FRANK CHANG;
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申请/专利号US20060908603

发明设计人 MAU-CHUNG FRANK CHANG;DAQUAN HUANG;
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申请日2006-08-02

分类号H01F5/00;H01F27/28;H01L27/08;

国家 US

入库时间 2022-08-21 16:42:42

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