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multi-layer composite structure, use of a multi-layer composite structure, and laminated structure

机译:多层复合结构,多层复合结构的使用和层压结构

摘要

COMPLIMENT LAYER STRUCTURE, USE OF A COMPLETE LAYER STRUCTURE, AND, LAMINATED STRUCTURE Composite laminates are described which may have high strength and / or low dielectric loss and may also be lightweight. The laminates include layers formed of high modulus polyolefin fiber. The fibers may be woven or knitted to form a cloth or may be included in a nonwoven cloth which may be one or more layers of the composite structures. Layers including high modulus polyolefin fibers may include other fibers, such as glass fibers. The composites may also include layers of other materials, for example layers formed of non-woven polyamide, glass fiber, or carbon fiber. The composites may be advantageously used in low loss dielectric applications, such as in the function of circuit board substrates, or in applications that beneficially combine resistance such as low weight, such as automotive and marine materials.
机译:复合层结构,完整层结构的使用以及层状结构描述了复合层合物,其可以具有高强度和/或低介电损耗并且还可以是轻质的。层压板包括由高模量聚烯烃纤维形成的层。纤维可以被编织或针织以形成布,或者可以被包括在无纺布中,该无纺布可以是复合结构的一层或多层。包括高模量聚烯烃纤维的层可以包括其他纤维,例如玻璃纤维。该复合材料还可包括其他材料的层,例如由非织造聚酰胺,玻璃纤维或碳纤维形成的层。所述复合材料可有利地用于低损耗电介质应用中,例如在电路板基板的功能中,或在有益地结合电阻的应用中,例如重量轻,例如汽车和船舶材料。

著录项

  • 公开/公告号BRPI0615205A2

    专利类型

  • 公开/公告日2013-01-08

    原文格式PDF

  • 申请/专利权人 INNEGRITY LLC;

    申请/专利号BR2006PI15205

  • 发明设计人 BRIAN G. MORIN;

    申请日2006-08-03

  • 分类号B32B5/22;B32B5/24;B32B5/26;B32B27/12;B32B27/32;D04H3;D04H5;

  • 国家 BR

  • 入库时间 2022-08-21 16:42:22

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