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PHOTOSENSITIVE ADHESIVE COMPOSITION PHOTOSENSITIVE ADHESIVE SHEET AND SEMICONDUCTOR DEVICE USING THE SAME
PHOTOSENSITIVE ADHESIVE COMPOSITION PHOTOSENSITIVE ADHESIVE SHEET AND SEMICONDUCTOR DEVICE USING THE SAME
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机译:感光胶组合物光敏胶板和使用该感光胶的半导体器件
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摘要
Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): Chemical Formula 1 wherein m and n in the general formula (1) are integers of 0 or more, which satisfy the relationship: 1 = m + n = 10, x is an integer of 1 or more and 5 or less, y is an integer of 1 or more and 10 or less, and y = 2x; and Chemical Formula 2 wherein R1 to R8 in the general formula (2) may be respectively the same or different, and selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen, a sulfone group, a nitro group and a cyano group. The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.
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机译:公开了一种光敏粘合剂组合物,其包含:(A)环氧化合物,(B)具有通式(2)表示的二胺残基的可溶性聚酰亚胺,(C)光聚合性化合物,以及(D)光聚合引发剂,其中环氧化合物(A)包含通式(1)表示的环氧化合物,并且可溶性聚酰亚胺(B)还具有通式(2)表示的二胺的残基:化学式1其中m和n通式(1)中的0为0以上的整数,满足以下关系:1 = m + n = 10,x为1以上5以下的整数,y为1以上10的整数或更小,且y = 2x;化学式2其中通式(2)中的R 1至R 8可以相同或不同,并且选自氢原子,具有1至30个碳原子的烷基,具有1至1个碳原子的烷氧基。 30个碳原子,卤素,砜基,硝基和氰基。本发明提供了一种感光性粘合剂组合物,该感光性粘合剂组合物可以在曝光后用碱性显影液进行显影,并且在基板上进行热压粘合时显示出高的粘合强度,并且绝缘稳定性也优异。
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