SINGLE-LAYERED WINDING OF SAWING WIRE WITH FIXEDLY BONDED ABRASIVE GRAIN FOR WIRE SAWS FOR SLICING WAFERS FROM A WORKPIECE

摘要

20Single-layered winding of sawing wire with fixedly bonded abrasive grain for wire saws for slicing wafers from a workpiece5AbstractThe invention relates to wire spools for a wire saw for slicing10 wafers from a workpiece, wherein the sawing wire coated with fixedly bonded abrasive grain is wound on the wire spool in a single-layered fashion.The invention is applicable both to single-cut wire saws and to 15 multiple wire saws.Fig. 3