首页> 外文OA文献 >Development of Brazed Diamond Abrasive Wire Saws for Slicing Single Crystal-Silicon

【2h】

Development of Brazed Diamond Abrasive Wire Saws for Slicing Single Crystal-Silicon

机译：钎焊钎焊丝锯切割单晶硅锯

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Makoto Inoue; Yasunori Murata; Taisuke Higashi; Takanori Onoki; Masaru Yokota; Atsushi Nakahira;
展开▼
作者单位

展开▼
年度 2009
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Comparison of slicing-induced damage in hexagonal SiC by wire sawing with loose abrasive, wire sawing with fixed abrasive, and electric discharge machining [J] . Yukari Ishikawa, Yong-Zhao Yao, Yoshihiro Sugawara, Japanese journal of applied physics . 2014,第7期

机译：用松散磨料的线锯，固定磨料的线锯和放电加工对六角形SiC切片引起的损伤的比较
2. A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC [J] . Wang Peizhi, Ge Peiqi, Li Zongqiang, Materials science in semiconductor processing . 2017,第期

机译：单晶SiC线锯片中金刚石磨粒的划痕力模型
3. Sawing stress of SiC single crystal with void defect in diamond wire saw slicing [J] . Gao Yufei, Chen Yang The International Journal of Advanced Manufacturing Technology . 2019,第1a4期

机译：钻石丝锯锯片锯切缺陷锯切缺陷
4. A COMPARISON OF RESIDUAL STRESS INDUCED BY FIXED ABRASIVE DIAMOND WIRE SAWING AND LOOSE ABRASIVE SLURRY WIRE SAWING IN MULTICRYSTALLINE SILICON WAFERS [C] . Vanessa Pogue, Shreyes Melkote, R. G. R. Prasath, European Photovoltaic Solar Energy Conference and Exhibition . 2016

机译：多晶硅硅晶片中固定磨石金刚石锯和松动磨料浆线锯切诱导的残余应力的比较
5. Characterization and analysis of the superabrasive diamond blade sawing process. [D] . Jerro, Harlan Dwayne. 1998

机译：超级磨料金刚石锯片锯切过程的表征和分析。
6. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw [O] . Tengyun Liu, Peiqi Ge, Wenbo Bi 2021

机译：用树脂粘合金刚石锯锯制线速对相变硅晶片中的相变和残余应力的影响
7. Development of a New Type Saw Wire Fixed Diamond Abrasive Grains with Solder and Ni Electroplating and Its Application to Slicing of Silicon and Sapphire Ingots [O] . Atsushi NAKAHIRA, Atsushi OKIMURA, Yasuhito HAGIWARA, 2015

机译：开发新型锯线固定金刚石磨粒，焊料和Ni电镀及其在切割硅和蓝宝石锭的切割中的应用
8. Silicon Ingot Casting: Heat Exchange Method (Hem). Multi-Wire Slicing: Fixed Abrasive Slicing Technique (Fast). Phase 3 and Phase 4: Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Projec [R] . Schmid, F., Khattak, C. P. 1982

机译：硅锭铸造：换热方法（下摆）。多线切片：固定磨料切片技术（快速）。第3阶段和第4阶段：低成本太阳能阵列项目大面积工作板的硅片增长开发

Development of Brazed Diamond Abrasive Wire Saws for Slicing Single Crystal-Silicon

著录项

引文网络

相似文献

相关主题

期刊订阅