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Dislocation and stress management by mask-less processes using substrate patterning and methods for device fabrication
Dislocation and stress management by mask-less processes using substrate patterning and methods for device fabrication
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机译:使用衬底图案的无掩模工艺进行的位错和应力管理以及器件制造方法
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摘要
Structures and methods for producing active layer stacks of lattice matched, lattice mismatched and thermally mismatched semiconductor materials, with low threading dislocation densities, no layer cracking and minimized wafer bowing, by using epitaxial growth onto elevated substrate regions in a mask-less process.
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