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HALOGEN-FREE FLAME-RETARDANT ADDITION TYPE ORGANOSILICON ENCAPSULANT FOR ELECTRONIC APPLIANCES

机译:电子电器用无卤阻燃添加型有机硅密封剂

摘要

The invention relates to a halogen-free flame-retardant addition type organosilicon encapsulant for electronic appliances, which comprises the following components: A) vinyl silicone oil; B) silicon dioxide or alumina treated by silane; C) a compound, each molecule of which contains an H-Si functional group, wherein the mass content of H is 0.1 to 1.2%; D) hydrolysate of vinyltrimethoxysilane(triethoxysilane) and gamma-(2,3-glycidoxy)propyl trimethoxysilane(triethoxysilane); E) chloroplatinic acid or 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex; F) one or more selected from the group consisting of carbon black, iron black, titanium dioxide, cerium oxide, benzotriazole, zinc carbonate and magnesium carbonate. The matter prepared in this invention is halogen-free and flame-retardant, also with heat conduction and adhesion performance to a certain degree and is very applicable to encapsulate of electronic appliances.
机译:本发明涉及一种用于电子设备的无卤阻燃加成型有机硅密封剂,其包括以下组分:A)乙烯基硅油; B)用硅烷处理过的二氧化硅或氧化铝; C)化合物,其每个分子包含H-Si官能团,其中H的质量含量为0.1-1.2%; D)乙烯基三甲氧基硅烷(三乙氧基硅烷)和γ-(2,3-环氧丙氧基)丙基三甲氧基硅烷(三乙氧基硅烷)的水解产物; E)氯铂酸或1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷铂络合物; F)选自炭黑,铁黑,二氧化钛,氧化铈,苯并三唑,碳酸锌和碳酸镁的一种或多种。本发明制备的物质是无卤阻燃的,也具有一定程度的导热和粘附性能,非常适用于电子设备的封装。

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