ELECTRONICS PACKAGE FOR HIGH TEMPERATURE DOWNHOLE APPLICATIONS

摘要

A downhole tool is described. The downhole tool includes a work device and an electronics packaging connected to the work device. The electronics packaging comprising a housing, a substrate, at least one first type component, and at least one second type component. The housing defines a void. The substrate is positioned within the void of the housing and forms a first cavity and a second cavity relative to the housing. The first cavity and the second cavity are isolated to form separate atmospheric chambers. The at least one first type component is disposed in the first cavity and connected to the substrate. The at least one second type component is disposed in the second cavity and connected to the substrate. The at least one first type component is different from the at least one second type component.