首页> 外国专利> METHOD FOR MANUFACTURING A SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID COATED WITH AN OVERGRID, AND SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID COATED WITH AN OVERGRID

METHOD FOR MANUFACTURING A SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID COATED WITH AN OVERGRID, AND SUBMILLIMETRIC ELECTRICALLY CONDUCTIVE GRID COATED WITH AN OVERGRID

机译:制造带有覆盖层的亚微米导电网格的方法以及覆盖有覆盖层的亚微米导电网格

摘要

A method of manufacturing a submillimetric electroconductive grid coated with an overgrid on a substrate includes: the production of a mask having submillimetric openings by the deposition of a solution of colloidal polymeric nanoparticles that are stabilized and dispersed in a solvent, the polymeric particles having a glass transition temperature Tg and the drying of the masking layer at a temperature below the Tg until the mask, with straight edges, is obtained, the formation of the electroconductive grid by a deposition of electroconductive material, referred to as grid material, a heat treatment of the masking layer with the grid material at a temperature greater than or equal to 0.8 times Tg, thus creating a space between the edges of mask zones and the lateral edges of the grid; a deposition of a layer, referred to as an overlayer, made of a material referred to as overlayer material, on the grid and in the space between the edges of mask zones and the lateral edges of the grid; a removal of the masking layer. The invention also relates to the grid thus obtained.
机译:一种制造在基板上涂覆有超网格的亚微米级导电格栅的方法,该方法包括:通过沉积稳定化并分散在溶剂中的胶态聚合物纳米颗粒的溶液来制造具有亚微米级开口的掩模。转变温度Tg以及在低于Tg的温度下干燥掩模层直到获得具有直边的掩模为止,通过沉积称为栅格材料的导电材料来形成导电栅格,并进行热处理在具有大于或等于Tg的0.8倍的温度的栅格材料的掩模层中,从而在掩模区域的边缘与栅格的侧向边缘之间形成空间;在栅格上以及在掩模区域的边缘与栅格的侧向边缘之间的空间中,沉积由称为覆盖层材料的材料制成的称为覆盖层的层;去除掩模层。本发明还涉及由此获得的格栅。

著录项

  • 公开/公告号EP2326601B1

    专利类型

  • 公开/公告日2013-06-05

    原文格式PDF

  • 申请/专利权人 SAINT-GOBAIN GLASS FRANCE;

    申请/专利号EP20090752413

  • 发明设计人 ZAGDOUN GEORGES;NGHIEM BERNARD;ROYER EDDY;

    申请日2009-09-25

  • 分类号C03C17;C03C17/36;C03C17/40;H01L51/52;H01L51/56;H01L51/10;

  • 国家 EP

  • 入库时间 2022-08-21 16:33:35

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