TITANIUM-NICKEL ALLOY THIN FILM, AND PREPARATION METHOD OF TITANIUM-NICKEL ALLOY THIN FILM USING MULTIPLE SPUTTERING METHOD

摘要

According to the present invention, a titanium-nickel alloy thin film is characterized in that Ti and Ni are deposited in a mixed state on a substrate by placing a Ti target and a Ni target spaced from each other inside a multiple sputtering apparatus, and simultaneously sputtering the same by applying different voltages. According to the present invention, a preparation method of a titanium-nickel alloy thin film using a multiple sputtering method comprises: the target preparation step of preparing a Ti target, a Ni target and a substrate; the target installation step of placing the Ti target and the Ni target spaced from each other inside a multiple sputtering apparatus; the apparatus setting step of setting the working conditions of the multiple sputtering apparatus; and the thin film depositing step of operating the multiple sputtering apparatus to form a Ti-Ni alloy thin film of a Ti and Ni mixed state on the substrate.