METHOD OF CONTROLLING A THERMAL BUDGET OF AN INTEGRATED CIRCUIT DEVICE, AN INTEGRATED CIRCUIT, A THERMAL CONTROL MODULE AND AN ELECTRONIC DEVICE THEREFOR

摘要

A method of controlling a thermal budget of an integrated circuit device is described. The method comprises obtaining a first junction temperature measurement value T₁ for the integrated circuit device at a first time instant t₁, and a further junction temperature measurement value T₂ for the integrated circuit device at a further time instant t₂. The method further comprises calculating a prospective junction temperature value T_P for the integrated circuit device at a future time instant t_p based at least partly on the first and further junction temperature measurement values T₁ and T₂; and configuring an operating condition of the integrated circuit device based at least partly on the calculated prospective junction temperature value T_P.