首页>
外国专利>
PRETREATMENT SOLUTION FOR ELECTROLESS NICKEL PLATING OR ELECTROLESS NICKEL ALLOY PLATING, AND PLATING METHOD
PRETREATMENT SOLUTION FOR ELECTROLESS NICKEL PLATING OR ELECTROLESS NICKEL ALLOY PLATING, AND PLATING METHOD
展开▼
机译:化学镀镍或化学镀镍的预处理溶液及镀敷方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A pretreatment solution which is brought into contact with a non-conductive substrate for pretreatment, said substrate being to be subjected to electroless nickel plating or electroless nickel alloy plating. The pretreatment solution is obtained by dispersing nickel particles in a solvent. The nickel particles have an average particle diameter of 1-200 nm, and are contained in an amount of 1-80% by weight relative to the pretreatment solution. By performing electroless nickel plating or electroless nickel alloy plating after immersing the non-conductive substrate into the pretreatment solution, a uniform plating film is formed over the entire surface of the non-conductive substrate.
展开▼