PRETREATMENT SOLUTION FOR ELECTROLESS NICKEL PLATING OR ELECTROLESS NICKEL ALLOY PLATING, AND PLATING METHOD

摘要

A pretreatment solution which is brought into contact with a non-conductive substrate for pretreatment, said substrate being to be subjected to electroless nickel plating or electroless nickel alloy plating. The pretreatment solution is obtained by dispersing nickel particles in a solvent. The nickel particles have an average particle diameter of 1-200 nm, and are contained in an amount of 1-80% by weight relative to the pretreatment solution. By performing electroless nickel plating or electroless nickel alloy plating after immersing the non-conductive substrate into the pretreatment solution, a uniform plating film is formed over the entire surface of the non-conductive substrate.