首页> 外国专利> NOVEL POLYBENZOXAZOLE COMPOUND HAVING HIGH HEAT RESISTANCE, COMPOSITION COMPRISING SAME FOR FORMING ORGANIC INSULATOR, AND THIN LAYER TRANSISTOR USING NOVEL POLYBENZOXAZOLE COMPOUND HAVING HIGH HEAT-RESISTANCE

NOVEL POLYBENZOXAZOLE COMPOUND HAVING HIGH HEAT RESISTANCE, COMPOSITION COMPRISING SAME FOR FORMING ORGANIC INSULATOR, AND THIN LAYER TRANSISTOR USING NOVEL POLYBENZOXAZOLE COMPOUND HAVING HIGH HEAT-RESISTANCE

机译:具有高耐热性的新型聚苯并恶唑化合物,其组成与有机绝缘体相同,并且使用具有高耐热性的新型聚苯并恶唑化合物制成的薄层晶体管

摘要

The present invention relates to a novel polymer compound, to a composition comprising same for forming an organic insulator, and to a thin layer transistor using the novel polymer compound. More particularly, the polymer compound has outstanding chemical resistance (especially chemical resistance to a base), insulating properties, and heat resistance, and can also form an insulator through a solution process, thus providing the advantageous effects of simplifying the process and reducing cost. Thus, the present invention can be effectively used for a composition for forming an organic insulator and a thin layer transistor.
机译:本发明涉及一种新颖的高分子化合物,涉及一种用于形成有机绝缘体的组合物,以及涉及一种使用该新颖的高分子化合物的薄层晶体管。更具体地,该高分子化合物具有优异的耐化学性(特别是对碱的耐化学性),绝缘性和耐热性,并且还可以通过溶液法形成绝缘体,从而具有简化工序和降低成本的有益效果。因此,本发明可有效地用于形成有机绝缘体和薄层晶体管的组合物。

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