首页> 外国专利> INSERT FOR A SEMICONDUCTOR PACKAGE FOR MOVING A PACKAGE FIXING BODY FIXING A LOCATION OF THE SEMICONDUCTOR PACKAGE WITHIN AN INSERT BODY WITH A SLIDE TYPE

INSERT FOR A SEMICONDUCTOR PACKAGE FOR MOVING A PACKAGE FIXING BODY FIXING A LOCATION OF THE SEMICONDUCTOR PACKAGE WITHIN AN INSERT BODY WITH A SLIDE TYPE

机译:用于移动包装固定体的半导体包装的插入件将带有滑动类型的插入体中的半导体包装的位置固定

摘要

PURPOSE: An insert for a semiconductor package is provided to fix the semiconductor package on an insert body.;CONSTITUTION: An insert(100) for a semiconductor package comprises an insert body(110), a package fixing body(120), an elastic supporting member(130), an open cover(140) and an open member(150). The insert body forms a package receiving groove which is extended to a vertical direction in the central unit. The package fixing body prevents separation from the package receiving groove in the semiconductor package. The elastic supporting member elastically supports the fixing body and moves the package fixing body to a close direction in the package receiving groove. The open cover accesses to the insert body or separates from the insert body. The open member opens the package receiving groove by moving the package fixing body.;COPYRIGHT KIPO 2013
机译:用途:提供用于半导体封装的插入物以将半导体封装固定在插入物主体上;构成:用于半导体封装的插入物(100)包括插入物主体(110),封装物固定主体(120),弹性体支撑构件(130),打开的盖(140)和打开的构件(150)。插入件主体形成包装容纳槽,该包装容纳槽在中央单元中沿竖直方向延伸。封装件固定体防止与半导体封装件中的封装件容纳槽分离。弹性支撑构件弹性地支撑固定体并使包装体固定体在包装体容纳槽中向闭合方向移动。打开的盖子可接近刀片体或与刀片体分离。打开构件通过移动包装固定体来打开包装接收槽。; COPYRIGHT KIPO 2013

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号